200A: 野村アセットマネジメント株式会社 NEXT FUNDS 日経半導体株指数連動型上場投信 | 貸借残高(日証協公表)

報告日貸付残高前週比借入残高(自己)前週比借入残高(転貸)前週比新規貸付成約高前週比新規借入成約高(自己)前週比新規借入成約高(転貸)前週比
2025-09-19(金)75,658+905372-1,237246,243-27,71112,600+8,180005,758-895
2025-09-12(金)74,753-31,5381,6090273,954-23,9564,420-64,584006,653-17,539
2025-09-05(金)106,291+18,6721,6090297,910+16,23569,004+40,5660024,192+13,665
2025-08-29(金)87,619-2,7211,6090281,675+37328,438+1,8930-14510,527-550
2025-08-22(金)90,340+9,6091,6090281,302-6,04426,545+3,323145+14511,077+5,952
2025-08-15(金)80,731-28,5861,6090287,346-21,01623,222-32,2670-1,2685,125-24,811
2025-08-08(金)109,317+4,6161,6090308,362+9,92055,489+8,7271,268+1,26829,936+5,968
2025-08-01(金)104,701-4,7471,609-214298,442-17,07646,762+17,7710023,968+12,351
2025-07-25(金)109,448-1,0611,823-1,000315,518-44228,991+3,9680-2,02411,617+6,039
2025-07-18(金)110,509-67,1622,823-758315,960-42,61525,023-75,8452,024+1,8895,578-45,638
2025-07-11(金)177,671+64,4613,581+135358,575+29,787100,868+19,114135+13551,216+30,091
2025-07-04(金)113,210+16,0123,4460328,788+12,43081,754+47,2520-1,31721,125+542
2025-06-27(金)97,198-110,1703,4460316,358-61,33134,502-107,7431,317-1,89020,583-53,058
2025-06-20(金)207,368+126,9343,4460377,689+59,460142,245+130,3773,207+3,20773,641+70,269
2025-06-13(金)80,434-11,1843,4460318,229-11,64111,868-676003,372-8,035
2025-06-06(金)91,618-9,1363,4460329,870-7,02812,544+8050011,407+3,679
2025-05-30(金)100,754+6,0583,4460336,898+4,18211,739+8,765007,728+6,119
2025-05-23(金)94,696-25,9333,4460332,716-16,4892,974-1,711001,609-3,907
2025-05-16(金)120,629-110,0783,446-2,544349,205-71,5314,685-129,040005,516-36,588
2025-05-09(金)230,707+10,6395,9900420,736+4,005133,725+81,7310042,104+31,656