200A: 野村アセットマネジメント株式会社 NEXT FUNDS 日経半導体株指数連動型上場投信 | 貸借残高(日証協公表)

報告日貸付残高前週比借入残高(自己)前週比借入残高(転貸)前週比新規貸付成約高前週比新規借入成約高(自己)前週比新規借入成約高(転貸)前週比
2024-08-23(金)213,063-6,00020,0390383,728-1,892000028,378+9,078
2024-08-16(金)219,063-50,50220,039-20,502385,620+2,4220-177,2250-40,54119,300-82,380
2024-08-09(金)269,565+123,52340,541+40,541383,198+49,205177,225+105,73340,541+40,541101,680+20,402
2024-08-02(金)146,042-22,29000333,993+68,83971,492-255,0840-58,78481,278-48,671
2024-07-26(金)168,332+147,24700265,154+130,003326,576+277,62458,784+4,784129,949-5,672
2024-07-19(金)21,085+18,39700135,151+45,44948,952+43,66854,000+54,000135,621+104,514
2024-07-12(金)2,688-2,8400089,702+9,8855,284-24,9000031,107+970
2024-07-05(金)5,528+2,7310079,817-4,14530,184+26,3870030,137+3,054
2024-06-28(金)2,797+2,6880083,962+17,5233,797+3,3510027,083+10,448
2024-06-21(金)109+740066,439+5,657446+4110016,635-5,940
2024-06-14(金)35+350060,782+18,25035-1520022,575-37,869
2024-06-07(金)0-0-42,532-187-0-60,444-