213A: 日興アセットマネジメント株式会社 上場インデックスファンド日経半導体株 | 貸借残高(日証協公表)

報告日担保貸付残高前週比借入残高(自己)前週比借入残高(転貸)前週比新規貸付成約高前週比新規借入成約高(自己)前週比新規借入成約高(転貸)前週比
2025-05-09(金)有担保118,440000126,260-4046,740+46,7400-2,60048,740+45,730
2025-05-09(金)無担保0000412,040-27000001,180-8,070
2025-05-02(金)有担保118,440-2,60000126,300+3,080002,600+2,6003,010+760
2025-05-02(金)無担保0000412,310+6,95000009,250-6,210
2025-04-25(金)有担保121,040-6,96000123,220-1,38000002,250+1,880
2025-04-25(金)無担保0000405,360+11,680000015,460+7,880
2025-04-18(金)有担保128,000-7,26000124,600-2,9900-3,11000370-2,810
2025-04-18(金)無担保0000393,680+57000007,580-7,200
2025-04-11(金)有担保135,260-9,96000127,590-33,1803,110+510003,180+2,100
2025-04-11(金)無担保0000393,110+12,250000014,780-4,620
2025-04-04(金)有担保145,220-14,55600160,770+13,9202,600-4,580001,080-2,510
2025-04-04(金)無担保0000380,860+19,050000019,400+15,800
2025-03-28(金)有担保159,776-9,33000146,850-12,5607,180+7,180003,590+3,290
2025-03-28(金)無担保0000361,810-697,69000003,600-371,480
2025-03-21(金)有担保169,106-21,26000159,410-3,5200-52,52600300-25,740
2025-03-21(金)無担保00001,059,500+357,9000000375,080+119,300
2025-03-14(金)有担保190,366+44,82600162,930+28,70052,526+39,1660026,040+16,610
2025-03-14(金)無担保0000701,600+352,5300000255,780+126,810
2025-03-07(金)有担保145,540+24,56000134,230+4,19013,360+13,360009,430+8,910
2025-03-07(金)無担保0000349,070+34,9600000128,970+101,340