213A: 日興アセットマネジメント株式会社 上場インデックスファンド日経半導体株 | 貸借残高(日証協公表)

報告日担保貸付残高前週比借入残高(自己)前週比借入残高(転貸)前週比新規貸付成約高前週比新規借入成約高(自己)前週比新規借入成約高(転貸)前週比
2025-02-28(金)有担保120,980-6,48000130,040-3000-6,76000520-980
2025-02-28(金)無担保0000314,110-5,840000027,630+25,130
2025-02-21(金)有担保127,460+6,48000130,340-9,9106,760+5,630001,500+920
2025-02-21(金)無担保0000319,950-4,52000002,500-8,020
2025-02-14(金)有担保120,980000140,250+1001,130+1,13000580-530
2025-02-14(金)無担保0000324,470-2,760000010,520-3,870
2025-02-07(金)有担保120,980-11,20000140,150+1,8000-7,710001,110-12,740
2025-02-07(金)無担保0000327,230-8,120000014,390+540
2025-01-31(金)有担保132,180-1,95000138,350+9,5307,710-15,1700-30013,850+9,520
2025-01-31(金)無担保0000335,350-11,950000013,850+11,920
2025-01-24(金)有担保134,130+8,90000128,820-35022,880+22,880300+1004,330+2,840
2025-01-24(金)無担保0000347,300-19,04000001,930-3,470
2025-01-17(金)有担保125,230-22,80000129,170-5,8700-18,630200+2001,490-70,000
2025-01-17(金)無担保0000366,340+3,56000005,400-246,810
2025-01-10(金)有担保148,030+19,18000135,040+3,25018,630-11,3700071,490+71,490
2025-01-10(金)無担保0000362,780-18,1500000252,210+251,450
2024-12-30(月)有担保128,850-13,70000131,790-19030,000+16,710000-1,000
2024-12-30(月)無担保0000380,930-4,1200000760-24,370
2024-12-27(金)有担保142,550-60000131,980-38013,290+13,290001,000+880
2024-12-27(金)無担保0000385,050+17,530000025,130+15,890