213A: 日興アセットマネジメント株式会社 上場インデックスファンド日経半導体株 | 貸借残高(日証協公表)

報告日担保貸付残高前週比借入残高(自己)前週比借入残高(転貸)前週比新規貸付成約高前週比新規借入成約高(自己)前週比新規借入成約高(転貸)前週比
2024-12-20(金)有担保143,150-20000132,360+400000120-780
2024-12-20(金)無担保0000367,520-8,57000009,240+980
2024-12-13(金)有担保143,350+13,80000132,320+1,2600000900-160
2024-12-13(金)無担保0000376,090+8,75000008,260+5,070
2024-12-06(金)有担保129,550-13,80000131,060-7,1900-13,550001,060-340
2024-12-06(金)無担保0000367,340-33,04000003,190-24,470
2024-11-29(金)有担保143,350+6,55000138,250+1,41013,550+6,550001,400+640
2024-11-29(金)無担保0000400,380-22,070000027,660+18,430
2024-11-22(金)有担保136,800-5,89000136,840-3807,000-5,79000760+10
2024-11-22(金)無担保0000422,450+5,83000009,230+1,230
2024-11-15(金)有担保142,690+21,09000137,220-2,30012,790+12,79000750-2,500
2024-11-15(金)無担保0000416,620-5,40000008,000-20
2024-11-08(金)有担保121,600-29,10000139,520-6,9600-10,000003,250-2,410
2024-11-08(金)無担保0000422,020-1000008,020-10,510
2024-11-01(金)有担保150,700+3,70000146,480+1,06010,000+9,960005,660+2,310
2024-11-01(金)無担保0000422,030-8,490000018,530+2,090
2024-10-25(金)有担保147,000+13,66000145,420+8,20040-23,360003,350-20,770
2024-10-25(金)無担保0000430,520+21,960000016,440+1,630
2024-10-18(金)有担保133,340-18,55000137,220-5,40023,400-6500024,120+19,160
2024-10-18(金)無担保0000408,560-3,100000014,810+10,320