213A: 日興アセットマネジメント株式会社 上場インデックスファンド日経半導体株 | 貸借残高(日証協公表)

報告日担保貸付残高前週比借入残高(自己)前週比借入残高(転貸)前週比新規貸付成約高前週比新規借入成約高(自己)前週比新規借入成約高(転貸)前週比
2024-10-11(金)有担保151,890-104,19000142,620-56,75024,050-89,840004,960-50,300
2024-10-11(金)無担保0000411,660-72000004,490-15,670
2024-10-04(金)有担保256,080+41,22000199,370+15,070113,890+101,1700055,260+46,000
2024-10-04(金)無担保0000412,380-2,060000020,160+17,160
2024-09-27(金)有担保214,860-9,30000184,300-21,55012,720-55,920009,260-32,360
2024-09-27(金)無担保0000414,440-32,97000003,000-8,310
2024-09-20(金)有担保224,160+26,22000205,850+16,04068,640+29,6000041,620+6,040
2024-09-20(金)無担保0000447,410-3,200000011,310-40,650
2024-09-13(金)有担保197,940-73,10000189,810-12,62039,040-33,2800035,580-18,900
2024-09-13(金)無担保0000450,610+53,890000051,960+1,880
2024-09-06(金)有担保271,040+59,34000202,430+22,31072,320+10,7000054,480+11,960
2024-09-06(金)無担保0000396,720-46,760000050,080-140,720
2024-08-30(金)有担保211,700+58,81000180,120+39,51061,620+42,5500042,520+29,830
2024-08-30(金)無担保0000443,480+126,4100000190,800+176,500
2024-08-23(金)有担保152,890-4,19000140,610-6,98019,070-100,8800-20,45012,690-66,830
2024-08-23(金)無担保0000317,070-68,710000014,300-44,260
2024-08-16(金)有担保157,080+93,15000147,590+72,070119,950+72,62020,450+20,45079,520+54,290
2024-08-16(金)無担保0000385,780+17,760000058,560-47,450
2024-08-09(金)有担保63,930+63,7100075,520+17,69047,330+21,4200025,230-9,780
2024-08-09(金)無担保0000368,020+85,4000000106,010+9,480