346A: 野村アセットマネジメント株式会社 NEXT FUNDS S&P 500 半導体・半導体製造装置35%キャップ指数連動型上場投信 | 貸借残高(日証協公表)

報告日貸付残高前週比借入残高(自己)前週比借入残高(転貸)前週比新規貸付成約高前週比新規借入成約高(自己)前週比新規借入成約高(転貸)前週比
2025-09-19(金)996+108005,793+9700-404001,376-3,333
2025-09-12(金)888+250005,784-3,0431,104-162004,709+2,755
2025-09-05(金)638+78008,827-6,5661,266+1,206001,954+1,598
2025-08-29(金)560-4600015,393-9360-91100356-3,179
2025-08-22(金)1,02000015,486+2,931971+181003,535+2,077
2025-08-15(金)1,020+5000012,555-1,335790+202001,458+349
2025-08-08(金)520-3230013,890-1,932588-509001,109-860
2025-08-01(金)843+3230015,822+8911,097+1,097001,969+530
2025-07-25(金)520-1,2720014,931-1,7500-972001,439-301
2025-07-18(金)1,792+7190016,681+3,850972+672001,740-2,996
2025-07-11(金)1,073+5530012,831+1,783300+47004,736+1,693
2025-07-04(金)520-1,1080011,048+1,433253+253003,043+1,450
2025-06-27(金)1,6280009,615+35600001,593+1,286
2025-06-20(金)1,6280009,259+8680000307-1,412
2025-06-13(金)1,6280008,391-1,13500001,719+1,220
2025-06-06(金)1,6280009,526-1100000499-284
2025-05-30(金)1,6280009,636+1110-99200783-441
2025-05-23(金)1,628-30009,525+1,192992-577001,224-1,734
2025-05-16(金)1,658-2,782008,333+7771,569+1,5690-9602,958+1,551
2025-05-09(金)4,4400007,556+1,5760-1,960960+9601,407-1,085
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