346A: 野村アセットマネジメント株式会社 NEXT FUNDS S&P 500 半導体・半導体製造装置35%キャップ指数連動型上場投信 | 貸借残高(日証協公表)

報告日貸付残高前週比借入残高(自己)前週比借入残高(転貸)前週比新規貸付成約高前週比新規借入成約高(自己)前週比新規借入成約高(転貸)前週比
2026-07-24(金)3,04900052,997+69450-91001,816+392
2026-07-17(金)3,049-1100052,303-1,671141-3,376001,424-1,137
2026-07-10(金)3,159-3,6560053,974-3,6443,517+846002,561-2,146
2026-07-03(金)6,815-1360057,618+7832,671+1,225004,707-181
2026-06-26(金)6,951+6060056,835-1,5391,446-1,413004,888-1,317
2026-06-19(金)6,345+2,8260058,374+2,6102,859+2,076006,205-51
2026-06-12(金)3,519-5900055,764+4,539783-919006,256-3,695
2026-06-05(金)4,109-1,0420051,225+4811,702-1,837009,951+2,394
2026-05-29(金)5,151-7520050,744+1,7943,539+375007,557+3,583
2026-05-22(金)5,903-1,0460048,950+7283,164-293003,974-3,627
2026-05-15(金)6,949+2,1560048,222+6,6683,457+3,457007,601+5,413
2026-05-08(金)4,793-8920041,554+9390-5,913002,188-2,212
2026-05-01(金)5,685+4,9700040,615+1,6375,913+5,862004,400+2,296
2026-04-24(金)71500038,978+1,48651-418002,104-1,224
2026-04-17(金)715-2,4900037,492-953469+469003,328+2,630
2026-04-10(金)3,205-2,0400038,445-2,4920-55200698-12,793
2026-04-03(金)5,245-260040,937+12,517552+5020-5013,491+12,411
2026-03-27(金)5,271-2440028,420-12,75050+5050+501,080-15
2026-03-19(木)5,51500041,170-9760-6,142001,095-2,642
2026-03-13(金)5,515+3,8900042,146+1,6266,142+5,425003,737+1,666
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