346A: 野村アセットマネジメント株式会社 NEXT FUNDS S&P 500 半導体・半導体製造装置35%キャップ指数連動型上場投信 | 貸借残高(日証協公表)

報告日貸付残高前週比借入残高(自己)前週比借入残高(転貸)前週比新規貸付成約高前週比新規借入成約高(自己)前週比新規借入成約高(転貸)前週比
2026-03-06(金)1,62500040,520+1,619717+717002,071+271
2026-02-27(金)1,62500038,901-2,2440-1,379001,800-25,005
2026-02-20(金)1,625+3690041,145+25,9171,379+1,3790-10026,805+26,026
2026-02-13(金)1,25600015,228-50,26300100+100779-2,074
2026-02-06(金)1,25600065,491+2,9890-6,582002,853-3,906
2026-01-30(金)1,256-13,8210062,502-5,1046,582-3,951006,759-18
2026-01-23(金)15,077+14,2310067,606+9,01010,533+5,371006,777-2,881
2026-01-16(金)846-2,4660058,596-1085,162+263009,658+4,143
2026-01-09(金)3,312+2,4660058,704+25,8914,899+4,899005,515-19,115
2025-12-30(火)84600032,813-24,7710-6000024,630+23,587
2025-12-26(金)846-6,1840057,584-3,704600-9,876001,043-7,236
2025-12-19(金)7,030+2,8120061,288-42,17510,476+4,070008,279-1,355
2025-12-12(金)4,218-1,52200103,463+4,1766,406+599009,634+6,679
2025-12-05(金)5,740+5,6940099,287+5,7075,807+5,049002,955-8,748
2025-11-28(金)46-6000093,580+78,968758+30011,703-61,454
2025-11-21(金)646-3,0640014,612-2,601755-0-73,157-
2025-11-14(金)3,710+2,0640017,213+2,417------
2025-11-07(金)1,646+1320014,796+3,1273,497+2,029002,849-925
2025-10-31(金)1,514-5800011,669-3,4141,468-996003,774+2,060
2025-10-24(金)2,094-1,7120015,083-4402,464-2,139001,714-2,811
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